Description:
JOB DESCRIPTION
Top 5 Required Skills (These are not preferred skills. If the candidate does not have these required skills, they will be rejected completely)
1. BGA installation using reflow machine
2. BGA level rework (like re-balling etc)
3. SMT soldering (0201/0402 size components)
4. Plastic enclosure, assembly/dis-assembly
5. QFN/DRQFN/SOT etc IC installation (soldering)
Required Education:
High School Diploma or equivalent or an electronics certification.
Required Years of Experience:
3+ years of experience in an engineering or related environment.
Job Description:
Manages and performs a variety of electrical and mechanical assembly, such as Circuit Card Assembly, components, devices, cables and some limited mechanical assembly. Prepares, loads and solders printed circuit boards, and performs rework and modifications. Manages and reports on prototype lab and stockroom activities. Obtains prototype and product build project needs and timetables to ensure project schedules are met.
Principal Duties and Responsibilities: Prepares, loads and solders printed circuit boards, with minimal supervision. Performs rework and modifications of CCAs and some basic components/devices.
Fabricates moderately complex wire harnesses and various cable assemblies.
Performs mechanical assembly of panels, test boxes and chassis.
Executes plans based on understanding of needs and requirements and resolves moderately complex build issues.
Reads and interprets moderately complex mechanical drawings and blueprints to perform a variety of assembly operations.
Performs moderately complex repair work, rework, removal, and modifications to assemblies or sub-assemblies as necessary.
Contributes to the creation of new processes.
Identifies and solves moderately complex issues and escalates other issues appropriately.
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