Packaging Module Development Engineer

PHOENIX, AZ, US • Posted 5 days ago • Updated 1 hour ago
Full Time
On-site
Fitment

Dice Job Match Score™

👾 Reticulating splines...

Job Details

Skills

  • Roadmaps
  • Assembly
  • Productivity
  • Data Analysis
  • Layout
  • Packaging Design
  • Interfaces
  • Procurement
  • Process Engineering
  • Conflict Resolution
  • Problem Solving
  • Manufacturing
  • Quality Management
  • Mechanical Engineering
  • Materials Science
  • Electrical Engineering
  • Physics
  • Applied Physics
  • Python
  • MATLAB
  • Semiconductor Fabrication
  • Statistical Process Control
  • Design Of Experiments
  • Artificial Intelligence
  • Machine Learning (ML)
  • Semiconductors
  • Military
  • Law

Summary

Job Description

This role requires regular onsite presence to fulfill essential job responsibilities. Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces. Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows. Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods. Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability. Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms. Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods. Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur. Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

Qualifications

You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

  • Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field with 3+ years of experience or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.

  • Experience listed above should be a combination of the following:

    • Programming/script (e.g., Python, MATLAB).

    • Semiconductor fabrication processes and technologies.

Preferred Qualifications:

  • One or more years of experience in one or more of the following areas:

    • Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)

    • Development with artificial intelligence and machine learning concepts.

    • Delivery of results for complex, time-critical technical projects.

    • Prior related work experience within a semiconductor foundry

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experience

Working Model

This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
  • Dice Id: RTX1d8578
  • Position Id: 95795231
  • Posted 5 days ago
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