Advanced Package Development Engineer

San Francisco, CA, US • Posted 3 days ago • Updated 10 hours ago
Full Time
On-site
Fitment

Dice Job Match Score™

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Job Details

Skills

  • MASS
  • Process Modeling
  • Specification Gathering
  • Microsoft Windows
  • 2.5D
  • 3D Computer Graphics
  • LVS
  • Integrated Circuit
  • Internal Communications
  • IC
  • Layout
  • calibre
  • Management
  • NPI
  • Metrology
  • Electrical Engineering
  • Physics
  • Mechanical Engineering
  • Conflict Resolution
  • Problem Solving
  • Analytical Skill
  • Communication

Summary

Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products.

In this role, you'll contribute to the advanced packaging technologies that enable Apple's industry-leading silicon performance. You'll work alongside world-class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production.

Description

- You will be responsible for advanced packaging development and pathfinding.

- Drive engagement with leading-edge foundries/OSATs to lead package integration, process definition, and architecture efforts.

- Define specs, drive process windows, and establish advanced packaging solutions (2.5D/3D, hybrid bonding, high-density wafer-level interconnects).

Minimum Qualifications

BS and 10+ years of experience in relevant industry experience.

Preferred Qualifications

MS/PhD and 6+ years of relevant industry experience in advanced wafer-level packaging.

Deep technical expertise in advanced packaging architectures and foundry processes

Hands-on experience reviewing GDS/layout data, physical verification (DRC/LVS), and working with IC layout/viewing tools (e.g., Calibre, Virtuoso, KLayout).

Proven track record managing foundry partners, defining DOEs, driving NPI engineering builds, and analyzing inline/end-of-line metrology and electrical test data.

Solid background in packaging physics, multi-domain interactions (thermo-mechanical, warpage, thin-wafer handling, reliability, and SI/PI fundamentals).

Strong problem-solving, analytical rigor, and communication skills to interface effectively with cross-functional and overseas foundry/OSAT partners.
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
  • Dice Id: 90733111
  • Position Id: 1dd83f597112eb85249488d69644432e
  • Posted 3 days ago
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