MEOS - Module Engineer On Shift

Job Description

Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

Module Engineers on Shift (MEOS) responsibilities include but are not limited to:

- Prioritize and organize daily activities around multiple requests for engineering experiments, daily alignment meeting preparation, chairing, documentation and action tracking, and quick and effective response to production issues.
- Be experts in all tools and processes in the area to support elaborate experiments and New Product Introductions.
- Be able to coach and role model the correct execution of module operations.
- Clearly understand and communicate execution issues, quality excursions, and equipment problems to Engineering and Manufacturing teams.
- Apply correctly and effectively the standard tools and methods to contain, mitigate, and solve issues, including Response Flow Checklists; Wiki-sites; Best Known Methods; Issue and Pass down Systems of Record; Equipment and Process checklists; Tool and Station Controller error messages and log files; Process Control charts. trends and events; Recipe Management Systems; Structured Problem-solving tools and templates. Escalations or pass down must include full documentation of steps and results obtained to that point, plus any next steps or recommendations.
- Ensure all Out-of-Control events have been annotated, reviewed and issues communicated for resolution
- First point of contact for Manufacturing.
- Spend more than 3/4 of your time on the production floor.
- Disposition and release un-scheduled hold lots within 10 hours and scheduled hold lots within 24 hours.
- Support Manufacturing on resolving any product recipe or parameter issues.
- Keep all Operation and Recipe Creation specs up to date.
- Initiate the investigation and documentation of quality excursions for the area, in partnership with Manufacturing and Factory Quality teams. Assume initial ownership where root cause is not evident.
- Prepare and execute New Product Introductions, including evaluation of recipe needs, collateral ordering, and recipe creation.
- Understand and ensure all data is collected on critical lots.
- Consolidate and prioritize area improvement projects with Manufacturing
- Support Working Group and Task Force activities, executing experiments and providing engineering data.
- Support Manufacturing Equipment Technicians on resolving any equipment issue.
- Support early processing of lots through new operations, then provide training, certification, and final endorsement to Manufacturing.

The candidate should exhibit the following behavioral traits:

- Strong technical problem-solving abilities with the ability to analyze and implement solutions in a dynamic operations environment.
- Demonstrated ability to collaborate with cross-functional teams and prioritize multiple activities effectively.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates.
Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:

• Bachelor?s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or a related field with 2+ years of relevant experience.
• Master?s degree in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Materials Science, or a related field with 6+ months of relevant experience.

Experience listed above should be in any the following:

• Semiconductor Equipment Development and/or Manufacturing
• Semiconductor Product Development and/or Manufacturing
• High Volume Technology Manufacturing
• Automated Manufacturing

This position is not eligible for Intel Immigration Sponsorship

Preferred Qualifications:

- High Volume Manufacturing experience is a plus.
- Engineering experience in Semiconductor Fab or Package Assembly is a plus.

We invite you to bring your expertise, creativity, and passion for innovation to Intel, where you can make a meaningful impact on the future of technology. Apply today to join our team and help drive Intel's success in delivering world-class packaging solutions.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits
Annual Salary Range for jobs which could be performed in the US $94,300.00-$133,200.00
*Salary range dependent on a number of factors including location and experience

Working Model

This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.