Key Responsibilities
Develop PCB layouts from released schematics, netlists, and engineering requirements with minimal oversight.
Perform component placement and routing for complex multilayer boards, including high-density and controlled impedance designs.
Execute high-speed digital, power, RF, and mixed-signal layouts in accordance with industry's best practices.
Apply sound design techniques for signal integrity, power integrity, EMI mitigation, grounding, and thermal considerations.
Generate complete fabrication and assembly documentation packages.
Collaborate with electrical engineers, mechanical engineers, and manufacturing teams to resolve layout challenges.
Interface with PCB fabrication and assembly vendors as needed to address technical questions.
Support DFM/DFT reviews and incorporate feedback efficiently.
Meet established design milestones within compressed development schedules.
Basic Requirements
7+ years of PCB layout experience (senior-level candidates preferred).
Advanced proficiency in Cadence Allegro PCB Designer/Editor.
Proven ability to independently complete complex board layouts.
Strong understanding of IPC standards and PCB fabrication/assembly processes.
Experience with multilayer stackups, controlled impedance routing, and high-density layouts.
Demonstrated experience working within structured release and configuration management systems.
Ability to quickly adapt to existing libraries, processes, and design standards.
Preferred Qualifications
IPC CID or CID+ certification.
Experience with:
High-speed digital interfaces (DDR, PCIe, SERDES, etc.)
RF layout and transmission line design
BGA fan-out and fine-pitch components
Power distribution networks and decoupling optimization
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