Mac Reliability Engineer

Austin, TX, US • Posted 13 hours ago • Updated 1 hour ago
Full Time
On-site
Fitment

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Job Details

Skills

  • User Experience
  • Exceed
  • Test Suites
  • Reliability Engineering
  • Collaboration
  • Hardware Development
  • Materials Science
  • Electrical Engineering
  • Mechanical Engineering
  • Testing
  • Failure Analysis
  • ROOT
  • Data Analysis
  • Level Design
  • Design For Manufacturability
  • Semiconductors
  • FMEA
  • Design Of Experiments
  • Analytical Skill
  • Microscopy
  • Scanning Electron Microscope
  • SEM
  • EDS
  • FTIR
  • XPS
  • JEDEC
  • Conflict Resolution
  • Problem Solving
  • Communication
  • Attention To Detail
  • Management

Summary

Do you ever wonder what goes into making Apple products an amazing user experience? The engineers on Apple's innovative reliability team are responsible for insuring that our products exceed our customer's expectations for robustness, durability, and reliability. We are looking for talented contributors who enjoy working on revolutionary products and aspiring to make them better through creation and execution of comprehensive test suites, identification of potential failure modes, and collaboration with design teams to drive product improvements.\\n

The position is on Apple's innovative Mac Reliability Engineering team, where we collaborate with hardware development and Silicon packaging. The engineer will be responsible for leading board level reliability on new Mac portables, development of new test procedures to quantify the reliability of a design, and failure analysis resulting from these tests.\n\n

MS in Materials Science, Electrical, Mechanical Engineering or an equivalent field with 2+ years of relevant engineering experience \nExperience performing board level reliability testing including Mechanical Stress Tests, Shock/Drop/Vibration Testing, Environmental Testing\nAbility to use fundamental failure analysis methodology to derive root cause of failures, knowledge of failure modes and statistical life data analysis using curve fitting and distributions models\nKnowledge of board level design, DFM (Design for Manufacturing) and reliability best practices to guide component selection and placement in early architecture \nStrong knowledge of Semiconductor package integration, SLI (Second Level Interconnect) reliability, passive components reliability, bonding materials and warpage control\nAbility to apply FMEA (Failure Modes an Effects Analysis) methodologies\n

Application of DOE (design of Experiments)\nFailure Analysis analytical techniques (Optical Microscopy, X-Ray, CSAM, SEM/EDS, FTIR, XPS etc)\nKnowledge of industry test Standards (JEDEC, ASTM, IEEE)\nExceptional problem solving abilities, written and verbal communication skills and strong attention to detail\nAbility to manage multiple projects at the same time\nDynamic and "can do" attitude with a desire to work with a great team and product\nAbility to travel internationally without restrictions\n
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
  • Dice Id: 90733111
  • Position Id: 2c9b48647cf063368043c743b96cd914
  • Posted 13 hours ago
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