Packaging Engineer (ICs/Sensors)

Title Packaging Engineer

Location Onsite in Fremont, CA

Duration 6-12 months, Contract-to-Hire

Ideal Start 3/2 or 3/9

Interview Process 2 Rounds

• MS Teams Video Call
• Onsite/Group MS Teams Interview

US Persons, Drug Test, & Background Check Required

Scope:

Oxford s client is in need of a packaging engineer to join their manufacturing team. They are looking for someone with a degree in Mechanical, Electrical, or Manufacturing to work on packaging for sensors (temperature, pressure, ICs, etc). This is not on the semiconductor fab side, but the post assembly of the dye. Their ideal candidate has a background in dye attach, wire bonding, gel fill, QFN, SOIC, etc. Their packaging is primarily plastics and stainless steel. Candidates should know the assembly processes that go into manufacturing (soldering/laser welding, epoxy fill) and optimization of wire bond/dye attached. There will be some vacuum/leak testing as well. Experience with DOE & FMEA is critical. Being able to identify what can go wrong, where, how bad it could go, and what could be done to mitigate actions is also crucial.

Skills

Packaging (ICs, sensors)

Assembly Processes

DOE

FMEA