Senior IC Packaging Engineer

Role: Senior IC Packaging Engineer

Location: San Jose, CA, USA- Remote

Department: Design

Job Description

Client is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup environment. This role is designed for a senior technologist who combines deep hands-on expertise with system-level thinking, and who thrives in high-ambiguity, high-impact settings.

You will define and drive high-performance, low-power packaging architectures spanning 2D and RDL based fan-out (2.5D), chiplet-based designs, and heterogeneous integration, leading efforts from early technology path finding through production ramp. You will work closely with foundries, OSATs, substrate suppliers, and internal cross-functional teams to shape both product execution and long-term packaging strategy.

Key Responsibilities

• Serve as technical authority for IC and SiP packaging across multiple products and programs.
• Own package architecture and technology roadmap, aligned with product, cost, and scalability goals.
• Lead chiplet-based packaging strategies, including UCIe, silicon interposers, and advanced RDL.
• Perform and guide hands-on package design and physical layout, including critical structures for High-speed SerDes/PHY (PCIe, CXL), LPDDR5, UCIe, and Other multi-gigabit interfaces.
• Define substrate stack-ups, materials, bump/RDL architectures, and DFM guidelines for advanced nodes.
• Drive SI/PI, thermal, mechanical, and reliability trade-offs at the system and package levels.
• Lead external engagement with OSATs, foundries, and key suppliers for technology development and manufacturing readiness.
• Influence product roadmap, risk management, and investment decisions through technical insight.
• Establish scalable design methodologies, best practices, and reusable packaging flows.

Qualifications

• BSEE or MSEE (PhD a plus) in Electrical Engineering, or related field.
• Minimum of 10+ years of experience with extensive IC packaging expertise for SoCs, ASICs, or memory products.
• Deep hands-on expertise in Flip-Chip BGA (FCBGA) and System-in-Package (SiP), RDL, silicon interposers, and chiplet architectures (UCIe)
• Strong understanding of electrical, mechanical, thermal, and reliability design trade-offs, Advanced packaging materials and substrate technologies, Design-for-Manufacturing (DFM) and yield optimization
• Demonstrated ability to operate autonomously, make high-impact decisions, and execute in a startup environment.

Required Experience

• Technical leadership of multiple end-to-end packaging programs, from early architecture through high-volume production.
• Proven experience with high-speed SerDes package development, including PCIe Gen5, LPDDR5 / LPDDR5X, USB 3.x or 10G interfaces
• Experience defining die-to-die and chiplet based RDL/bump architecture.
• Direct collaboration with OSATs, foundries, and substrate suppliers for co-development and ramp.
• Strong cross-functional leadership across design, product, test, operations, reliability, and customer teams.
• Clear understanding of cost, yield, schedule, and risk trade-offs at a product and portfolio level.

Tools & Preferred Skills

• Cadence Allegro Package Designer (APD) or equivalent EDA tools.
• Strong background in flip-chip BGA package design and layout.
• SI/PI expertise preferred, including S-parameter extraction and PDN optimization using HFSS, SIwave, or Ansys Designer.
• Experience building new packaging methodologies or platforms from scratch.