Chandler, Arizona
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Job Title: IC Packaging Design Engineer Location: Chandler, AZ or Hillsboro, OR (100% Onsite) Duration: Long-Term Contract (12+ Months) Employment Type: C2C / W2 Openings: 4 Job Description We are seeking experienced IC Packaging Design Engineers with strong expertise in package substrate design and advanced package layout. The ideal candidate should have hands-on experience with Siemens (Mentor) Xpedition (XPD) or Cadence Allegro Advanced Package Designer (APD/SiP) and a solid understandin
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Full-time, Part-time, Third Party, Contract
