Phoenix, Arizona
•
3d ago
Top Mandatory Skills: 7+ years of advanced semiconductor packaging experience.Hands-on experience with 2.5D & 3D packaging technologies.Strong experience with chiplet architectures and heterogeneous integration.Experience with multi-die package design, silicon interposers, TSV, and advanced substrate technologies.Experience supporting AI/HPC semiconductor products from concept through production.Strong knowledge of package assembly, manufacturing, reliability, yield improvement, and qualificatio
Easy Apply
Third Party, Contract
Depends on Experience
