2.5D Jobs

1 - 20 of 33 Jobs

Maintenance Technician & GroundskeeperJob Title - Maintenance Technician & Groundskeeper

Hudson CompaniesCompany Name - Hudson Companies

•

Pennsylvania, USA

Full-time

Maintenance Technician & Painter in Cranberry Township, PA, US. Our team is on the lookout for dedicated maintenance technicians and groundskeepers to join us in Cranberry Township! You'll make sure our facilities are operating efficiently, regularly inspect our building for any damage, and conduct routine maintenance on our equipment to keep it running smoothly. The ideal person for this job is a reliable team player and a problem solver who has some prior maintenance or groundskeeping experie

System Signal Integrity EngineerJob Title - System Signal Integrity Engineer

Apple, Inc.Company Name - Apple, Inc.

•

No location provided

Full-time

The candidate will work within the Mac organization to support the system-level signal integrity (SI) design, analysis, and validation aspects of Mac and Accessory products development from the conceptual design phase to the production. You should have deep knowledge and familiarity with all aspects of signal and power integrity for high speed SerDes, Parallel bus, and single-ended signaling. Come join us! Description System signal integrity engineer involves all aspects of signal integrity desi

CoWoS Principle Packaging EngineerJob Title - CoWoS Principle Packaging Engineer

Zachary Piper Solutions, LLCCompany Name - Zachary Piper Solutions, LLC

•

Saratoga, California, USA

Full-time

Piper Companies is looking for a CoWoS Principle Packaging Engineer who will construct and enhance Chip-on-Wafer-on-Substrate packaging technology to support high-performance AI and data center applications onsite in Saratoga, CA . The ideal CoWoS Principle Packaging Engineer will collaborate with cross-functional teams to facilitate smooth integration of advanced multi-die packages. Responsibilities for the CoWoS Principle Packaging Engineer: Lead the advancement of CoWoS packaging technolog

Director of Packaging Engineering - CoWoSJob Title - Director of Packaging Engineering - CoWoS

Zachary Piper Solutions, LLCCompany Name - Zachary Piper Solutions, LLC

•

Saratoga, California, USA

Full-time

Piper Companies is seeking a Director of Packaging Engineering - CoWoS to join our dynamic team onsite 5 days per week in Saratoga, CA. The Ideal Director of Packaging Engineering - CoWoS will spearhead the development and refinement of Chip-on-Wafer-on-Substrate packaging technology for high-performance AI and data center applications. Responsibilities for the Director of Packaging Engineering - CoWoS Lead the advancement of CoWoS packaging technology to enhance chip performance, power, and

Principal Packaging EngineerJob Title - Principal Packaging Engineer

Zachary Piper Solutions, LLCCompany Name - Zachary Piper Solutions, LLC

•

Saratoga, California, USA

Full-time

Piper Companies is seeking a Principal Packaging Engineer who will develop and refine Chip-on-Wafer-on-Substrate technology. The Packaging engineer will be preferred in office in Saratoga, CA, but is open to remote. Requirements for the Packaging Engineer include: - Innovate and enhance CoWoS packaging processes to boost chip performance, power efficiency, and reliability. - Collaborate with design, test, and manufacturing teams to ensure flawless chip-package integration. - Lead failure analys

Senior Chassis Mechanical Design EngineerJob Title - Senior Chassis Mechanical Design Engineer

Zachary Piper Solutions, LLCCompany Name - Zachary Piper Solutions, LLC

•

Saratoga, California, USA

Full-time

Piper Companies is currently seeking a Senior Chassis Mechanical Design Engineer to work on-site in Saratoga, CA 5 days per week . The ideal Senior Chassis Mechanical Design Engineer is eager to solve complex challenges and help shape the future of AI networking technologies. Responsibilities of the Senior Chassis Mechanical Design Engineer: Design and optimize chassis components using CAD software (SolidWorks, AutoCAD, CATIA). Develop and improve IC packages, focusing on thermal management, e

Microelectronics Advanced Packaging SMEJob Title - Microelectronics Advanced Packaging SME

Booz Allen HamiltonCompany Name - Booz Allen Hamilton

•

Remote

Full-time

Job Number: R0216856 Microelectronics Advanced Packaging SME Key Role: Provide technical leadership and subject matter expertise to U.S. government clients in the areas of advanced microelectronics packaging technologies, including silicon interposer assemblies, flip chip, BGA, advanced interconnect, multi-chip modules, and 2.5D or 3D heterogenous integration. Identify and assess the performance of packaging providers and technologies against defense needs and requirements. Define strategies and

Senior Architect, High Speed InterfaceJob Title - Senior Architect, High Speed Interface

ARMCompany Name - ARM

•

Austin, Texas, USA

Full-time

Job DescriptionWe are looking for a Senior Architect High Speed Interface to own the definition and deployment of high-speed interconnects in our System designs. This role focuses on die-to-die (D2D) interconnects and off-chip SerDes solutions. You will be responsible for selecting and optimizing interface IP including PHY and controller subsystems for use in advanced multi-die and chiplet solutions. You will evaluate vendor IP, guide architecture tradeoffs, and ensure efficient integration of h

Server Platform ArchitectJob Title - Server Platform Architect

ARMCompany Name - ARM

•

San Jose, California, USA

Full-time

Job DescriptionJob Overview:At Arm an Server Platform Architect is a technical role responsible for architecting and designing high-volume, sophisticated, SoC platforms on groundbreaking nodes across multiple market segments including mobile, automotive, datacenter and networking, and IoT. Arm's Server Platform Architects play a meaningful role in the development of production-quality silicon with outstanding performance and power efficiency, both in partnership with Arm partners and producing A

Principal Test EngineerJob Title - Principal Test Engineer

ARMCompany Name - ARM

•

Austin, Texas, USA

Full-time

Job DescriptionThis is a great opportunity to join Arm's Silicon Solutions Test Team working with emerging process technologies and the latest packaging innovations. The test team works closely with IP, SoC Design, Product and Systems teams, to represent test engineering and drive test capability development within Arm. You will play a key role in preparing Arm and our partners for how to address production challenges in areas like 2.5D/3DIC and sub-3nm nodes. The role requires hardworking engin

IP Power Integrity Lead EngineerJob Title - IP Power Integrity Lead Engineer

Broadcom CorporationCompany Name - Broadcom Corporation

•

Fort Collins, Colorado, USA

Full-time

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: IP Power Integrity Lead Engineer Broadcom's ASIC Product Division (APD) is focused on enabling customers to develop products with a sustainable and substantial competitive advantage. APD does this by delivering best in class technology platforms, easy

Power Systems Design Engineer - Data Center GPUJob Title - Power Systems Design Engineer - Data Center GPU

AMD (Advanced Micro Devices)Company Name - AMD (Advanced Micro Devices)

•

Austin, Texas, USA

Full-time

WHAT YOU DO AT AMD CHANGES EVERYTHING We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world's most important challenges. We strive for execution excellenc

Advanced Package Technology EngineerJob Title - Advanced Package Technology Engineer

Broadcom CorporationCompany Name - Broadcom Corporation

•

Fort Collins, Colorado, USA

Full-time

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom pac

Signal Integrity / Power Integrity Engineer - Advanced PackagingJob Title - Signal Integrity / Power Integrity Engineer - Advanced Packaging

Marvell Semiconductor Inc.Company Name - Marvell Semiconductor Inc.

•

Boise, Idaho, USA

Full-time

About Marvell Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and be

Signal Integrity Engineer, PrincipalJob Title - Signal Integrity Engineer, Principal

Marvell Semiconductor Inc.Company Name - Marvell Semiconductor Inc.

•

Santa Clara, California, USA

Full-time

Failure Analysis Staff EngineerJob Title - Failure Analysis Staff Engineer

Marvell Semiconductor Inc.Company Name - Marvell Semiconductor Inc.

•

Santa Clara, California, USA

Full-time

Sr. Principal Package EngineerJob Title - Sr. Principal Package Engineer

Marvell Semiconductor Inc.Company Name - Marvell Semiconductor Inc.

•

Santa Clara, California, USA

Full-time

Principal SOC Pre-Silicon Verification Engineer- HBM DesignJob Title - Principal SOC Pre-Silicon Verification Engineer- HBM Design

Micron Technology, Inc.Company Name - Micron Technology, Inc.

•

Richardson, Texas, USA

Full-time

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applic

Power Integrity Engineer, PrincipalJob Title - Power Integrity Engineer, Principal

Synopsys, Inc.Company Name - Synopsys, Inc.

•

Sunnyvale, California, USA

Full-time

Descriptions & Requirements Job Description and Requirements We Are: At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation. In the System Solutions Gr

Signal Integrity and Power Integrity Application EngineerJob Title - Signal Integrity and Power Integrity Application Engineer

Cadence Design Systems IncCompany Name - Cadence Design Systems Inc

•

Austin, Texas, USA

Full-time

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. The candidate will work closely with Sales Account Managers and technical field application engineers supporting technical campaigns by delivering workshops, product demonstrations, training, and onsite support. The candidate will have good knowledge of the Cadence toolset and/or equivalent competitor toolsets in the context of multiple flows including high-speed signal design, power de