2.5D jobs in Washington

Redmond, Washington

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Today

Overview Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft's expanding Cloud Infrastructure and responsible for powering Microsoft's "Intelligent Cloud" mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and complian

Full-time

USD 142,800.00 - 274,800.00 per year

Senior/Principal Power and Signal Integrity Engineer

Redmond, Washington

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Today

Overview Microsoft Quantum is working to build scalable quantum computing systems through advances in quantum devices, cryogenic complementary metal-oxide-semiconductor (Cryo-CMOS) electronics, advanced packaging, system architecture, software, and cloud infrastructure. This work brings together disciplines across the computing stack to help scientists tackle problems that are beyond the reach of today's computing platforms. Learn more about our team at Microsoft Quantum. We are seeking a Seni

Full-time

USD 119,800.00 - 234,700.00 per year

Systems Analyst V 100% Remote In Texas

Remote or Austin, Texas

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Today

Join the Texas Health and Human Services Commission (HHSC) and be part of a team committed to creating a positive impact in the lives of fellow Texans. At HHSC, your contributions matter, and we support you at each stage of your life and work journey. Our comprehensive benefits package includes 100% paid employee health insurance for full-time eligible employees, a defined benefit pension plan, generous time off benefits, numerous opportunities for career advancement and more. Explore more detai

Full-time

USD 5,797.66 - 7,652.91 per month

Applications Engineer- SiC in Advanced Packaging

Remote

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Today

As an Applications Engineer for Advanced Packaging, you will provide pre- and post-sales technical support to customers integrating Wolfspeed SiC substrates into 2.5D and 3D packaging architectures for high-performance computing (HPC) and AI data center applications. Building on Wolfspeed's 35+ years of SiC materials leadership and an established portfolio of proven use cases, you will act as the technical bridge between our materials expertise and the customer's package design - showing custome

Full-time

2.5D jobs in Washington, USA