Electronic Packaging jobs in Yorktown Heights, NY

Associate Quantum Hardware Assembly R&D Engineer

Yorktown Heights, New York

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Yesterday

Introduction Overview IBM Quantum is seeking a motivated Associate Quantum Hardware Assembly R&D Engineer to join the Quantum Hardware team at the IBM Thomas J. Watson Research Center in Yorktown Heights, NY. This entry-level role offers an exciting opportunity to develop advanced electronic packaging technologies for next-generation quantum computing systems. The ideal candidate is a collaborative team player with strong attention to detail, a strong growth mindset, and a passion for hands-on

Full-time

Mechanical Engineer II

Danbury, Connecticut

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Today

Job Title: Mechanical Engineer II Job Category: Engineering Time Type: Full time Minimum Clearance Required to Start: None Employee Type: Regular Percentage of Travel Required: Up to 10% Type of Travel: Local * * * The Opportunity: CACI Danbury is seeking a Mechanical Engineer who reports to the Electro-Mechanical Engineering Supervisor. This position is part of the Mechanical Engineering department and supports design and analysis of hardware for opto-mechanical and/or electro-mechanica

Full-time

USD 72,700.00 - 149,200.00 per year

Mechanical Engineer - Electrical Packaging

Wilton, Connecticut

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Today

Introduction of the job As an Mechanical Engineer - Electronics Packaging specialist you will specify, design, develop, realize, integrate, and test modules and tools in a multi-disciplined team, collaborating closely with cross-functional partners and suppliers. You will deliver within system specifications, cost targets, and project schedules, ensuring timely realization of solutions that contribute to competitive, achievable, and serviceable products. The Mechanical Engineer provides discipl

Full-time

USD 69,000.00 - 101,000.00 per year

Senior Mechanical Engineer - Electronics Packaging

Wilton, Connecticut

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Today

Introduction of the job As a Mechanical Engineer - Electronics Packaging specialist you will specify, design, develop, realize, integrate, and test modules and tools in a multi-disciplined team, collaborating closely with cross-functional partners and suppliers. You will deliver within system specifications, cost targets, and project schedules, ensuring timely realization of solutions that contribute to competitive, achievable, and serviceable products. The Mechanical Engineer provides disciplin

Full-time

USD 102,375.00 - 151,000.00 per year

RF Mechanical Engineer I (Onsite)

Remote or Tucson, Arizona

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Today

Date Posted: 2026-09-28 Country: United States of America Location: US-AZ-TUCSON-M02 ~ 1151 E Hermans Rd ~ BLDG M02 Position Role Type: Onsite U.S. Citizen, U.S. Person, or Immigration Status Requirements: Active and transferable U.S. government issued security clearance is required prior to start date.Security Clearance Type: DoD Clearance: Secret Security Clearance Status: Ability to obtain INTERIM U.S. government issued security clearance is required prior to start date Are you ready

Full-time

USD 57,200.00 - 108,800.00 per year

Principal Structural & Mechanical Analysis Engineer - Remote within the U.S.

Remote or Pennsylvania

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Today

Job Title: Principal Structural & Mechanical Analysis Engineer - Remote within the U.S. Posting Start Date: 10/9/26 At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Description: Job Overview The Digital Data Networks (DDN) Business Unit is seeking a highly skilled and driven PRINCIPAL R&D/PRODUCT DVL ENGINEER within the Advanced Development (AD) team. In this key technical role, you wi

Full-time

USD 158,200.00 - 197,800.00 per year

Electronic Packaging jobs in Yorktown Heights, NY 10598, USA