San Diego, California
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Today
Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: This role represents an individual contributor within the CHS Signal Integrity organization responsible for end-to-end signal integrity and power integrity architecture, analysis, and signoff for next-generation mobile, compute, automotive, and various other connectivity platforms. Core Responsibilities Perform high-frequency measurements of passive structures using VN
Full-time
USD 133,900.00 - 200,900.00 per year
