Corvallis, Oregon
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Today
Wafer Bond Process Engineer Description - HP is seeking a highly motivated Process Engineer to provide technical leadership for wafer bonding technologies supporting both high-volume manufacturing and next-generation MEMS product development. This role is responsible for sustaining and improving existing wafer bonding processes while leading the development, qualification, and implementation of new bonding technologies, materials, equipment, and manufacturing capabilities. The successful cand
Full-time
USD 93,400.00 - 143,800.00 per year