San Diego, California
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Today
Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: Qualcomm Data Center team is developing a high performance, energy efficient server solution for data center applications. The qualified individual will develop thermal solutions for server products at package and system levels resolving complex thermal management challenges related to high-performance servers. Key Responsibilities Lead thermal architecture solutions
Full-time
USD 180,400.00 - 270,600.00 per year