Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: As a Finish Team (Bond, CMP, Plating) Equipment Engineer with Broadcom Limited's Wireless Semiconductor Division (WSD), you will own and support equipment used to develop and execute advanced processes in our state of the art 8" wafer fabrication facil