We are seeking a CAD & Methodology Engineer to develop, enable, and support 3DIC and 2.5D physical design and signoff methodologies for advanced multi-die systems. This role focuses on building robust, scalable, and production-ready flows spanning timing, power, IR/EM, ESD, thermal, CFD/FEM, and multiphysics analysis, in close collaboration with physical design, package, PI, reliability, and EDA vendor teams. The ideal candidate brings hands-on understanding of advanced-node implementation and