San Jose, California
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Today
Role Overview As a Principal Package Thermal & Mechanical Engineer, you will serve as a technical leader driving the development and modeling of advanced IC packaging solutions that enable next-generation AI and high-performance connectivity systems. In this highly visible role, you will define and execute thermal and mechanical modeling strategies across the chippackageboard system, influencing package architecture, material selection, and reliability design. You will partner closely with packa
Easy Apply
Full-time
185000 - 225000
