Senior Radio Frequency Engineer (Contingent)

Oklahoma City, OK, US • Posted 30+ days ago • Updated 5 hours ago
Full Time
On-site
USD $135,000.00 - 150,000.00 per year
Fitment

Dice Job Match Score™

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Job Details

Skills

  • Assembly
  • GFI
  • Computer Hardware
  • ICS
  • RAID
  • Management
  • Collaboration
  • Program Management
  • PMP
  • Reporting
  • Mentorship
  • Documentation
  • Training
  • Science
  • Layout
  • RF
  • HFSS
  • Requirements Engineering
  • EMI
  • EMC
  • Employee Self-service
  • Testing
  • Security Clearance
  • Health Care
  • Life Insurance
  • Training And Development
  • Health Insurance

Summary

  • Lead High Power Amplifier Circuit Card Assembly redesign to achieve strict Form-Fit-Function-Interface compatibility
  • Plan and execute measurements of GFP/GFI hardware; derive and verify baseline parameters (gain/flatness, impedance/VSWR, output power, spectral purity, pulse shape/timing)
  • Develop correlated RF and thermal simulation models; evaluate device topologies (BJT/LDMOS/GaN) and output combining networks
  • Author and maintain requirements in MBSE; produce SSS and ICS with full traceability to sources and verification methods
  • Own EMI/EMC and environmental planning; define fixtures and pre-qualification per applicable standards
  • Prepare and lead SRR/PDR with Government stakeholders; capture minutes, actions, and update RAID log
  • Coordinate U.S. vendor market survey; manage NDAs; integrate supplier inputs on risks, manufacturability, and prototype ROM
  • Collaborate with program management to maintain PMP and IMS; report status, risks, and mitigations
  • Mentor team members; uphold engineering rigor and documentation quality
  • Other duties as assigned

This position is contingent upon contract award.

Requirements

Education/Training:
    • Bachelor's Degree in relevant engineering or science discipline required
    • Master's degree preferred

Experience:
    • 8+ years experience designing, testing, and qualifying RF power amplifiers for radar or high-power pulsed applications (L-band preferred)
    • Hands-on experience with BJT/LDMOS/GaN device selection, biasing, matching networks, and microstrip layout
    • Proficiency building high-fidelity RF and thermal models (e.g., Ansys HFSS/Icepak) and correlating to measured data
    • Requirements engineering using MBSE tools (e.g., Cameo)
    • Authoring System/Subsystem Specifications and Interface Control Specifications
    • EMI/EMC planning and pre-qualification per MIL-STD-461; environmental and ESS testing per MIL-STD-810

Security:
    • If selected candidate does not have an active Clearance at level Secret or higher, one will be obtained upon hire

Physical Requirements:
    • Able to occasionally reach with hands and arms
    • Prolonged periods of computer screen use, while sitting or standing at a desk
    • Adhere to safety protocols when in work areas requiring use of PPE (e.g. eyewear, gloves, masks, hearing protection, steel toed shoes, etc.)
    • Able to safely lift and carry up to 20 pounds at a time

Benefits

  • Health Care Plan (Medical, Dental & Vision)
  • Retirement Plan (401k, IRA)
  • Life Insurance (Basic, Voluntary & AD&D)
  • Paid Time Off (Vacation, Sick & Public Holidays)
  • Short Term & Long Term Disability
  • Training & Development
  • Wellness Resources

Salary: $135,000 - $150,000

Salary rates for this position are competitive and commensurate with experience and industry standards. We offer a comprehensive benefits package that may include health insurance, paid time off, and retirement savings options.
Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
  • Dice Id: 10290392
  • Position Id: ac260a1d7d9b53c59258eba9dd75108d
  • Posted 30+ days ago
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