Please Note:1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)2. If you already have a Candidate Account, please Sign-In before you apply.Job Description:Broadcom's Global Operations supporting Core Switching Group is seeking a candidate for an ATE Test Hardware Development Engineer. Products include networking switches for NIC, Scale Up, Scale Out, Scale Across networking for traditional and AI data centers. This position is at our R&D center in Irvine, CA. The successful candidate will have hands-on experience of developing test hardware including PCB, mechanical components. Knowledge in test programs development using UltraFlex testers is preferred.
Responsibilities
- Test Hardware Development: Responsible for driving hardware development including final test and probe. This involves working with PCB designer, probe vendor, socket vendor.
- Debug: Debug and bring up test hardware on ATE
- Test Development: Develop ATE DIB diagnostics program for networking switches that are high power and have high speed SERDES (>100G)
- SERDES Layout: Knowledge and expertise of laying out multi-lane 200G/400G SERDES on PCB and substrate.
- Simulation Experience: Knowledge about Signal Integrity and Power Integrity is required
- Cross functional: Work closely with Design Engineers, Test Engineers, Board Vendors, Socket Vendors, Probe Vendors, Thermal Equipment Vendors
- Hardware Program Management: Manage and track all hardware for CSG for R&D and Production
Skills/Experiences
- Hands-on experience with Teradyne UltraFlex Plus tester platforms
- In depth knowledge of PCB design including very high power and high speed SERDES layout on PCB and advanced substrate with Cadence and Mentor Graphics EDA tools
- Must be able to support debugging/troubleshooting of various failure mechanisms with the test hardware
- Programming experience preferred for test diagnostics development
- Ability to work with test hardware development teams, able to understand chip performance at ATE and contributions from the test hardware on chip behavior
- Experienced with extreme temperature testing of ASICs at ATE
- Experience with AI tools for quick script development is a plus
Education:
Bachelor's Degree in Engineering and 8+ years of related experience, or Master's Degree in Engineering and 6+ years of related experience
Additional Job Description:Compensation and BenefitsThe annual base salary range for this position is $108,000 - $172,800
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence. 
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