Hybrid in Gaithersburg, Maryland
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Job Number: R0228570 Microelectronics Packaging Subject Matter Expert Key Role: Leverage technical leadership and subject matter expertise to defense clients in the areas of advanced microelectronics packaging technologies, including silicon interposer assemblies, flip chip, ball grid array, advanced interconnect, multi-chip modules, and 2.5D or 3D heterogenous integration. Identify and assess the performance of packaging providers and technologies against defense needs and requirements. Define
Full-time
USD 99,000.00 - 225,000.00 per year