2.5D Jobs in Maryland

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Microelectronics Advanced Packaging SME

Booz Allen Hamilton

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Remote

Full-time

Job Number: R0216856 Microelectronics Advanced Packaging SME Key Role: Provide technical leadership and subject matter expertise to U.S. government clients in the areas of advanced microelectronics packaging technologies, including silicon interposer assemblies, flip chip, BGA, advanced interconnect, multi-chip modules, and 2.5D or 3D heterogenous integration. Identify and assess the performance of packaging providers and technologies against defense needs and requirements. Define strategies and
Posted 16 days ago | Updated 10 hours ago

Cyber Security, Cyber Operations, and Threat Analyst 2025

Lockheed Martin Corporation

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Bethesda, Maryland, USA

Full-time

Job Description Attention: Applying to this Expression of Interest opportunity introduces you to Lockheed Martin's job opportunities and promotes you to managers who are interested in hiring for multiple roles. You can not and will not be hired on this requisition. You spent years defending your country in uniform, or making sacrifices as a veteran or military spouse. Now you can contribute to the defense of our cyber assets from the persistent global threat. Lockheed Martin has Cyber Security
Posted 60+ days ago | Updated 9 hours ago

PCB Layout Engineer

Randstad Digital

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Remote or Phoenix, Arizona, USA

Contract

job summary: Exciting opportunity for an experienced Principal PCB & Substrate Layout Engineer to join a growing, engaging, and collaborative team. As a valued team member, you will collaborate to deliver leading edge microelectronics that are game changing and impactful to our nation's defense. The successful candidate will be part of a dynamic team that is transforming the business and the defense-grade microelectronics industry while executing on near-term program commitments while fosteri