Oklahoma City, Oklahoma
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Today
Lead High Power Amplifier Circuit Card Assembly redesign to achieve strict Form-Fit-Function-Interface compatibilityPlan and execute measurements of GFP/GFI hardware; derive and verify baseline parameters (gain/flatness, impedance/VSWR, output power, spectral purity, pulse shape/timing)Develop correlated RF and thermal simulation models; evaluate device topologies (BJT/LDMOS/GaN) and output combining networksAuthor and maintain requirements in MBSE; produce and ICS with full traceability to sou
Full-time
USD 135,000.00 - 150,000.00 per year








