Hillsboro, Oregon
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Today
Role : IC Packaging Design Engineer LOC: Chandler, AZ or Hillsboro, OR (ONSITE) Experience : !0+ years Skills Required : - Bachelor s or Master s degree in Electrical /Electronics Engineering Experience Tier: Senior-level (primary); Mid-level (secondary) Senior-Level: ~10+ years in IC packaging / package design Mid-Level: 4-6+ years (MS) or 6+ years (BS) in IC packaging / package design Strong hands-on experience in Siemens (Mentor) Xpedition (XPD); Alternatively: Cadence Allegro/Advanced Pa
Easy Apply
Full-time, Part-time, Third Party, Contract















