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Chip Desgner/Packaging

eTeam, Inc.

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Santa Clara, California, USA

Contract

Job Title: Chip Desgner/Packaging Job Location: Santa Clara, CA (Hybrid) IC Packaging & Chiplet Integration : 2.5D/3D packaging, flip-chip bonding, TSV, hybrid bondingSemiconductor Processing : BEOL/FEOL integration, advanced interconnects, thin-film deposition (PVD, PECVD, ALD, CVD)Design & Simulation : Siemens NX, Cadence, ANSYS, EasyEDA, ThermoCalcHigh-Speed I/O & Signal Integrity : Impedance control, power/signal integrity, substrate optimizationProcess Development & Metrology : DOE, SPC,
Easy Apply
Posted 2 days ago

Semiconductor Process Technician C (Palm Bay, FL)

L3Harris Technologies

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Palm Bay, Florida, USA

Full-time

L3Harris is dedicated to recruiting and developing high-performing talent who are passionate about what they do. Our employees are unified in a shared dedication to our customers' mission and quest for professional growth. L3Harris provides an inclusive, engaging environment designed to empower employees and promote work-life success. Fundamental to our culture is an unwavering focus on values, dedication to our communities, and commitment to excellence in everything we do. L3Harris Technologie
Posted 1 hour ago

Internship, Materials Engineering (Fall 2025)

Tesla Motors

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Fremont, California, USA

Full-time

Consider before submitting an application: This position is expected to start around August or September 2025 and continue through the Fall term (ending approximately December 2025) or continuing into Winter/Spring 2026 if available and there is an opportunity to do so. We ask for a minimum of 12 weeks, full-time and on-site, for most internships. Our internship program is for students who are actively enrolled in an academic program. entry level candidates seeking employment after graduation a