PCB Layout Engineer

Job Title: PCB Layout Engineer
Location: Maynard, MA (Onsite)

About the Role

We are seeking a highly experienced PCB Layout Engineer to support the development of leading-edge optical communication products. The ideal candidate brings a strong, recent, hands-on technical background and can hit the ground running as an individual contributor.

Key Responsibilities

• Contribute to, or lead, PCB and package substrate layout development for leading-edge optical communication products.
• Ensure compliance with IPC standards, company design practices, and fabrication capabilities.
• Collaborate with electrical, mechanical, thermal, signal-integrity, power-integrity, and manufacturing teams.
• Work with PCB fabricators and substrate vendors to close DFMs.

Minimum Requirements

• Bachelor's degree or equivalent certifications, with 10+ years of relevant industry experience in PCB board and/or package substrate layout engineering.
• Expert-level proficiency with Cadence Allegro PCB design tools.
• Strong demonstrated experience with complex high-density, high-speed PCB and substrate designs using advanced HDI, stacked micro-via, sequential lamination, and fine-pitch BGA technologies.
• Hands-on experience with complex multilayer high-density organic substrates, fine-pitch BGAs, and advanced component packages.
• Working understanding of transmission line layout geometries and rules (microstrip, stripline, CPW, etc.).
• Demonstrated experience in the layout of compact, low-voltage, high-current multiphase DC-DC power converters for state-of-the-art processors and GPUs.
• Strong understanding of PCB fabrication, assembly processes, DFM, and manufacturing tolerances.
• Demonstrated success delivering high-volume, high-reliability communication products under aggressive schedules.

Highly Desired Skills

• Demonstrated experience with mSAP PCB layout design.
• Experience with layout design of state-of-the-art optical pluggable products (CFP2, QSFP-DD, OSFP).
• Proficiency in Cadence SiP tools and substrate layout techniques.
• Proficiency in layout of designs with wire bond components.
• Strong knowledge of relevant industry standards (IPC Class 2/3, JEDEC, etc.).