Senior Mechanical Engineer (Semiconductor Equipment)

Gloucester, MA, US • Posted 1 day ago • Updated 1 day ago
Contract Corp To Corp
Contract W2
Contract Independent
No Travel Required
Able to Sponsor
On-site
Depends on Experience
Fitment

Dice Job Match Score™

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Job Details

Skills

  • Mechanical design
  • CREO/Pro-E CAD modeling
  • BOM management
  • ECO/ECN change control
  • PLM tools (Agile/Windchill)
  • semiconductor equipment knowledge
  • manufacturing support & troubleshooting
  • GD&T and drawing interpretation
  • root cause analysis (8D/5 Whys)
  • cross-functional communication

Summary

Key Responsibilities

•            Design & Documentation

o            Design and develop and update Manufacturing drawings using Pro/ENGINEER (Pro E/Creo).

o            Create and maintain BOMs, part lists, and drawing packages; ensure drawing readability and GD&T awareness for mechanical interfaces.

o            Review, interpret, and redline engineering drawings;

•            Change Control & Configuration Management

o            Initiate and process ECO (Engineering Change Orders), ECN (Engineering Change Notices), VPR (Vendor Part Requests/Reviews), and QN (Quality Notifications) within Agile PLM and Windchill.

•            Manufacturing & Onsite Support

o            Provide onsite build support for semiconductor equipment—troubleshoot Manufacturing and Shop floor issues

o            Collaborate with assembly teams to resolve design-for-manufacture (DFM) and design-for-service (DFS) concerns.

•            Quality & Problem Solving

o            Lead root cause analysis using structured problem-solving (8D, Fishbone, 5 Whys) and implement robust corrective/preventive actions.

o            Address QNs, drive closure with measurable effectiveness;

Required Skills & Tools

•            CAD: Pro E/Creo for Modelling and detailing and harness drawings; familiarity with Windchill PLM.

•            PLM & PDM: Agile PLM and Windchill for change control, releases, and configuration management.

•            Change Processes: Hands-on with ECO, ECN, VPR, QN workflows.

•            Documentation: Strong drawing reading, redlining, revision control, and release practices.

•            Problem Solving: Proven track record of resolving build issues quickly and permanently;

•            Communication: Clear, concise communication with shopfloor teams and engineering stakeholders.

Nice-to-Have:

•            Experience with semiconductor equipment (vacuum systems, gas boxes).

•            Exposure to safety standards , and SEMI standards

•            Knowledge of DFM/DFS, Lean manufacturing, and design validation processes.

•            Vendor interaction for manufacturing and first article inspection (FAI).

Behavioral Competencies:

•            Ownership & accountability for deliverables and release quality.

•            Attention to detail with strong configuration discipline.

•            Onsite agility—hands-on, collaborative, and proactive.

•            Structured problem solving and continuous improvement mindset.

Employers have access to artificial intelligence language tools (“AI”) that help generate and enhance job descriptions and AI may have been used to create this description. The position description has been reviewed for accuracy and Dice believes it to correctly reflect the job opportunity.
  • Dice Id: 10426508
  • Position Id: BR#: 1628885BR
  • Posted 1 day ago
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