San Jose, California
•
19d ago
Requirements/Skills: Exp: 5-8 years of experience. Possess Mentor Graphics, Cadence, PLA knowledge Multiple layers package design (8+) experienceUnderstanding of substrate manufacturing design rule and assembly rulePossess Flip Chip Package Design ConceptGood communication skill.May require vendor on-site support Regards Rohit
Easy Apply
Contract
$50 - $60